Job Information

Cadence Design Systems, Inc. Sr Product Marketing Manager (IC Packaging) in San Jose, California

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Cadence's CPG Product Management team is hiring for a Product Marketing Manager focused on product/strategy definition and execution for Electronic Design Automation (EDA) software. The position will have responsibility of directly driving the success of the Allegro-based IC packaging technologies.

Key responsibilities in this position are:

  • Specializing in fan-out wafer-level packaging technologies, you will establish your technical credibility to become the go-to person for the Cadence advanced IC packaging tools and flows.

  • Based on customer needs, provide in-depth technical assistance in collaboration with R&D to help support advanced design flows for advanced IC packaging

  • Champion the customer needs and work with R&D and WFO to develop competitive and creative technical solutions.

  • Using your hand-on knowledge of the tools and technologies, develop rapid adoption kits for FOWLP packaging technologies.

  • Understand the competitive landscape and continuously work on differentiating Cadence’s solutions.

  • Assist WFO in managing strategic customer evaluations/benchmarks on Cadence's IC packaging solutions to establish technology differentiation and assert Cadence competitive advantages.

  • Contribute to the creation of technical product literature such as application notes and technical articles.

  • Develop and deliver product demonstrations.

  • Participate in the creation of new products from pricing through release.

Leverage and build your technical expertise in one or more of the following areas:

  • Multi-chip(let) packaging architectures

  • Full-flow, from planning to tape-out for advanced packaging

  • Physical verification tools for package-level sign-off

  • Deep technical understanding of modern IC packaging technologies


  • Bachelor's degree in Electrical or Computer Engineering or Computer Science or equivalent

  • 5+ years of experience in advanced multi-chip(let) package design and analysis

  • Deep knowledge of Cadence Allegro-based IC packaging solutions

  • Strong verbal and written communication skills in English

  • Up to 30% travel

We’re doing work that matters. Help us solve what others can’t.

Cadence plays a critical role in creating the technologies that modern life depends on. We are a global electronic design automation company, providing software, hardware, and intellectual property to design advanced semiconductor chips that enable our customers create revolutionary products and experiences.

Thanks to the outstanding caliber of the Cadence team and the empowering culture that we have cultivated for over 25 years, Cadence continues to be recognized by Fortune Magazine as one of the 100 Best Companies to Work For. 
Our shared passion for solving the world’s toughest technical challenges, our dedication to pushing the limits of the industry, and our drive to do meaningful work differentiates the people of Cadence.

Cadence is committed to creating a diverse environment and is proud to be an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, sex, age, national origin, religion, sexual orientation, gender identity, status as a veteran, basis of disability, or any other protected class.