CASY-MSCCN Jobs

Job Description

In this position you will be part of the package design Platform Signal integrity and Power Integrity team.

Your responsibilities will include but not be limited to:

• Responsible for package design from the planning phase to tape-out of high-density package substrates for Intel FPGA products

• Collaborate and work with highly multi-disciplined teams across geos

• Package route feasibility study and fit study, during the early phase of package definition

• Support the development of pin map/ball map, in collaboration with Package Architect, Design Lead, Power Integrity, and Signal Integrity engineers

• Perform package substrate design including package size fit assessment, package stack-up study, signal, and power routing

• Optimize package layout including ball map/bump map, stack-up and design methodology

• Planning and executing the package substrate design activities, meeting the schedule and quality expectations

• Drive the substrate physical design reviews with stakeholders as per plan and meet the schedule and quality expectations

• Validating the design using design validation tools

• Perform package substrate design per business process from layout to documentation

Qualifications

Job Qualifications

You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualification:

• Bachelor's or Master's Degree in Electrical/Electronic Engineering or related field

• 3+ years of experience in delivering high-speed high-density flip chip interconnect-based package designs or Printed Circuit Boarddesign (PCB), using Mentor Xpedition or Allegro Tool for physical design

Preferred qualifications:

• Familiar with Design tools i.e. Mentor, Cadence, AutoCAD, Zukens, PADs, Altium or layout ECAD tools

• Knowledge of signal integrity and power integrity fundamentals

Inside this Business Group

The Programmable Solutions Group (PSG) was formed from the acquisition of Altera. As part of Intel, PSG will create market-leading programmable logic devices that deliver a wider range of capabilities than customers experience today. Combining Altera's industry-leading FPGA technology and customer support with Intel's world-class semiconductor manufacturing capabilities will enable customers to create the next generation of electronic systems with unmatched performance and power efficiency. PSG takes pride in creating an energetic and dynamic work environment that is driven by ingenuity and innovation. We believe the growth and success of our group is directly linked to the growth and satisfaction of our employees. That is why PSG is committed to a work environment that is flexible and collaborative, and allows our employees to reach their full potential.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.